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Fourté creates complete mechanical enclosure solutions for the 10 Gigabit Small Form-factor Pluggable (XFP) transceiver module. We can create custom designs to accommodate your specific needs while remaining compliant with the XFP Multi Source Agreement (MSA).


XFP Metal Enclosure

XFP Release Mechanism

XFP Cage


The XFP metal enclosure protects the internal features and allows for easy insertion into the XFP cage. The external features of the XFP metal enclosure remain compliant with XFP MSA while the internal features are customized to your application.

Die Cast Housings. Fourté uses customizable inserts in the master die cast tool to accommodate specific internal features of your XFP metal enclosure.

Machined Housings. Machined housings are used during the prototype phase of the design. We create aluminum prototypes of the XFP metal enclosure.

Features and Benefits
• Machined or die cast
• Two-piece design
• Easy manufacturability
• Easy assembly
• Robust design for DFM


 

The XFP release mechanism is a metal stamped product with a molded top which is color-coated for different wavelengths. The three piece solution that attaches to the metal enclosure includes a bail, a slide, and two pins.

The XFP release mechanism includes a bail latch design for easy insertion and removal into the standardized XFP cage. It is widely accepted across the world as the Industry Standard for XFP transceiver modules. The robust and minimally intrusive design allows module manufacturers to easily incorporate the design into a standard XFP transceiver module. The XFP release mechanism conforms to XFP MSA and is also RoHS compliant.


Features and Benefits
• Distinct home position
• Bail rotates 90 degrees
   - Triggers mechanism to disengage module from cage
• Robust design, rugged
• MSA compliant
• RoHS compliant
• Easily implemented to custom applications
• Allows wide range of placement for optical plane
• Industry standard and proven designs
• Cost effective solutions
• Color-coated for different wavelengths

 

The XFP cage assembly includes the XFP cage, XFP heat sink, and XFP heat sink clip. The XFP cage assembly conforms to XFP MSA and is RoHS compliant.

XFP Cage. The XFP cage assembly incorporates EMI shielding capabilities for the front, upper rear, intermediate rear, and lower rear of the cage along with providing guidance for the connector, retention of the transceiver, and features for heat sink attachment. The metal cage has compliant leads for assembly to the host board.

XFP Heat Sink. Fourté produces XFP heat sinks for your standard and custom applications. The XFP heat sink is used in applications that require increased heat dissipation. The XFP heat sink includes a beveled edge which "rides up" the leading edge of the transceiver as the transceiver is inserted into the cage assembly. All Fourté XFP heat sinks abide to the .025mm flatness on the surface of the belly.

XFP Heat Sink Clip. When fastened to the XFP cage, the XFP heat sink clip provides a minimum force of 5 Newtons at the interface of the XFP heat sink and XFP transceiver. The clip is designed to permit a XFP heat sink to be fastened to the XFP cage and to expand slightly during transceiver insertion in order to maintain a contact force between the transceiver and heat sink.

Features and Benefits

• RoHS compliant
• MSA compliant
• Robust one-piece solution
    -Rigid cage
• 3D foot design
    -High retention force in printed circuit board
• Available in press-fit, solder post and PCI (1°) versions
• Spring fingers with two points of contact
• Optional rear-pin design for belly-to-belly applications
• One-piece stamped and formed cage
• Enables use with various board thicknesses and assembly processes
• Offer optimal EMI grounding
• Provides additional PCB real estate with opposite board-side usage
• Guarantees cages are RoHS compliant by eliminating solder
• Allow for flexibility of PCB signal routing of LEDs




 
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